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Advanced Thermal Management

Integrating disruptive thermal structures with scalable mass production to break performance bottlenecks and empower the next generation of high-end thermal products.

Key Benefits

- Unlimited Design Freedom

Overcoming the limitations of traditional subtractive manufacturing to construct TPMS lattices, conformal cooling channels, and high-aspect-ratio micro-channels. This maximizes surface area and optimizes fluid dynamics for significantly improved heat exchange efficiency.

- Integrated & Leak-Proof

Achieving monolithic printing. This completely eliminates weak points caused by traditional brazing , fundamentally removing the risk of coolant leakage and ensuring long-term system reliability.

- Material Versatility

Resolving the printing of highly reflective metals like Pure Copper (density ~99.8%). This provides a one-stop solution covering diverse performance needs.

- Mold-Free Agile Iteration

Direct digital manufacturing eliminates the need for expensive mold development, shortening the R&D verification cycle from months to days. This reduces trial-and-error costs, making it perfectly suited for high-end customization and small-batch pre-research projects.

Materials
Case Study
TPMS Liquid Cold Plates

Advantage: Monolithic, braze-free construction featuring complex TPMS lattices (Gyroid/Diamond) for optimal flow distribution.


Result: Boosts heat transfer by 28% while lowering flow resistance and effectively minimizing critical hot spots.


New Generation IGBT Heatsink Base Plate

Advantage: Bypasses traditional forged fin bottlenecks utilizing 3D-printed micro-structures, including optimized bottom textures and spiral cones.


Result: Drives a 30–40% increase in thermal efficiency within the exact same physical footprint.


Data Processor Thermal Module

Advantage: Advanced fin and needle/rectangular hybrid structures designed to actively guide fluid flow and maximize surface area.


Result: Outperforms traditional copper sheet heatsinks by achieving significantly enhanced thermal uniformity.


Semiconductor Thermal Module

Advantage: Hybrid construction featuring a 3D-printed base with complex micro-structures (irregular textures, spiral cones, and horizontal strips).


Result: Delivers a verified 6–7x thermal efficiency gain over traditional copper plates.


Teardrop-Shaped Liquid Cold Plates

Advantage: Advanced teardrop geometry for optimal fluid dynamics.


Result: Drastically reduces flow resistance, boosting heat transfer while lowering pump energy costs.


Conformal Channel Liquid Cold Plate

Advantage: True 3D conformal routing with internal fin/pin/needle hybrids. Impossible via traditional machining.


Result: Maximizes heat-transfer surface area to ensure highly uniform thermal distribution across complex components.


Aluminum Alloy Heat Exchangers

Advantage: Monolithic AlSi10Mg with topology optimization and 0.08mm ultra-thin lattices.


Result: Highly leak-resistant, radically lighter, and delivers superior thermal mixing.


Related Additive Manufacturing Machine
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Shenzhen Addireen Technologies Co., Ltd.

Building 7, Detai Technology Park, Dalang Street, Longhua District, Shenzhen, Guangdong, China.

(+86) 193-5719-8013

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