This is the most critical and frequently mentioned advanced application, utilizing TPMS to optimize fluid dynamics and heat exchange. 

●Core Structure :

Uses Gyroid, or Diamond lattice structures to fill flow channels. 

●Performance Advantage :

Provides massive Surface Area compared to traditional channels, ensuring uniform fluid distribution and eliminating Hot Spots. 

●Efficiency Boost : 

Heat transfer performance improves by approximately 28% under the same pumping power, with significantly reduced flow resistance.

●Manufacturing : 

Monolithic printing eliminates brazing and removes leakage risks.

Designed to minimize pressure drop and fluid resistance using hydrodynamic optimization. 

Core Design : Features an array of teardrop-shaped pin fins. 

Fluid Dynamics : Compared to cylindrical pins, the teardrop shape significantly reduces fluid flow separation and turbulence, leading to a much lower pressure drop. 

Efficiency: Maintains high heat transfer efficiency while allowing for lower pumping power or higher flow rates.

Designed for high-frequency heating systems, eliminating the weak points of traditional brazed assemblies. 

●Background: Traditional coils are manufactured by bending copper tubes and brazing them manually. These brazing joints are prone to water leakage and fatigue failure under thermal stress. 

●Design Optimization: 

     ○One-Piece Construction: Printed as a single monolithic unit using Green Laser PBF, completely eliminating welding seams. 

     ○Material: Pure Copper with 101% IACS electrical conductivity. 

     ○Conformal Cooling: Internal water channels are designed to follow the coilʼs curvature perfectly. 

Results: Service life extended significantly due to higher structural rigidity.

Designed for IGBT power modules in EVs or industrial controls, breaking the limits of traditional cold-forged pin fins. 

●Background : Traditional Pin Fin technology has hit a thermal bottleneck. 

●Micro-structure Design : 

     ○Bottom features Irregular concave and convex textures. 

     ○Surface covered with Conical columns with spiral micro-structures, impossible with cold forging. 

     ○Added Horizontal square strips for turbulence induction. 

●Results : Thermal efficiency improved by 30%-40% within the same installation space.

Addressing poor thermal uniformity in traditional heatsinks for servers or high-performance chips. 

●Replacement : Replaces copper sheet heatsinks. 

●Design Change : Internally features a fin-based, needle+rectangular-based, and a combination of multiple structures. 

●Function : Increases surface area and acts as a fluid Guide, significantly improving thermal uniformity.

For semiconductor components with extremely high heat flux density, demanding massive efficiency gains. 

Goal : Customer required a 5x efficiency increase over the original copper plate solution. 

Structure : Combines irregular textures, spiral micro-structure cones, and horizontal strips into a composite design. 

Test Results : Final tests showed a 6-7x increase in thermal efficiency. 

Process : 3D printed base plate + welded cover (Hybrid manufacturing).

Utilizing 3D printing freedom to create non-linear, conformal cooling channels

●Conformal Cooling : Channels are designed to follow the 3D contour of the heat source, rather than a simple 2D plane. 

●Internal Features : Internally features a fin-based, needle+rectangular-based, and a combination of multiple structures to maximize turbulence and surface area in critical zones. 

●Benefits : Solves the issue of uneven heating in complex-shaped components where traditional machining cannot reach.